Micross Components becomes worldwide distributor for GeneSiC Semiconductor Bare Die
Micross Components, a provider of distributed and specialty electronic components, and GeneSiC Semiconductor, a pioneer in Silicon Carbide (SiC) technology, announce an agreement establishing Micross as an authorized supplier of GeneSiC's bare die products worldwide.
The driving force behind the agreement is the shared commitment of both companies to increase the availability of SiC bare die to industrial, military, aerospace, and energy (particularly, drilling and exploration) customers.
For years, Silicon has been the building block of semiconductor design and fabrication because of its natural abundance, processing ease and relatively useful, although limited, temperature range. SiC, which is a manmade compound, offers enhanced performance, a broader temperature range, greater reliability, and natural radiation resistance.
Until recently, challenges and costs associated with SiC production had limited its use among semiconductor manufacturers, but GeneSiC, with its design and fabrication advances, has successfully increased yields. This has resulted in more competitive pricing and offerings, such as GeneSiC's Schottky diodes, which offer significant design and performance advantages.
Extending those advantages to bare die customers will be Micross' role under the new agreement. As the leading independent distributor of die products worldwide, Micross has both the product and assembly expertise required to certify the GeneSiC bare die for high-temp/high-reliability applications, as well as the sales channels needed to reach potential customers around the globe. Further, with its technical knowledge and resources, Micross can provide long-term product support to all die customers.